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TPS92001D Datasheet(PDF) 2 Page - Texas Instruments |
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TPS92001D Datasheet(HTML) 2 Page - Texas Instruments |
2 / 14 page TPS92001, TPS92002 SLUSA24 – FEBRUARY 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted (1) RANGE UNIT VDD 19 Input voltage range SS -0.3 to REF + 0.3 V RTC, RTD -0.3 to REF + 0.3 IREF -15 Continuous input current mA IVDD 25 Output current IGD (tpw < 1 µs and Duty Cycle < 10%) -0.4 to 0.8 A Operating junction temperature TJ −55 to +150 °C Storage temperature Tstg −65 to +150 Lead temperature Soldering, 10 s +300 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal. RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT VDD Input voltage 21 V IGD Output sink current 0 A TJ Operating junction temperature –40 105 °C DISSIPATION RATINGS qJA, THERMAL qJB, THERMAL TA = 25°C TA = 85°C TB = 85°C IMPEDANCE IMPEDANCE PACKAGE POWER POWER POWER JUNCTION-TO-AMBIENT, JUNCTION-TO-BOARD, RATING (mW) RATING (mW) RATING (mW) NO AIRFLOW (°C/W) NO AIRFLOW (°C/W) SOIC-8 (D) 165(1) 55 606(2) 242(2) 730(2)(3) MSOP-8 (DGK) 181(1) 62 552(2) 221(2) 664(3)(2) (1) Tested per JEDEC EIA/JESD51-1. Thermal resistance is a function of board construction and layout. Air flow will reduce thermal resistance. This number is included only as a general guideline; see TI document SPRA953 IC Package Thermal Metrics. (2) Maximum junction temperature TJ, equal to 125°C. (3) Thermal resistance to the circuit board is lower. Measured with standard single-sided PCB construction. Board temperature, TB, measured approximately 1 cm from the lead to board interface. This number is provided only as a general guideline. ELECTROSTATIC DISCHARGE (ESD) PROTECTION MIN MAX UNIT Human body model 2000 V CDM 1500 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS92001 TPS92002 |
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