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FEATURES

• Allows the use of 0.65mm pitch surface-mount ICs in thru-hole designs.

• Ideal for prototyping and testing/evaluating SSOP ICs.

• Adapter can be cut to smaller sizes by end user.

• Consult factory for Panelized Form or for mounting of consigned ICs.

GENERAL SPECIFICATIONS

• ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces

• PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M

• PIN PLATING: 200µ [5.08µ] min. Sn/Pb 93/7 per ASTM B579-73 over 100µ

[2.54µ] Ni per SAE AMS-QQ-N-290 with 10µ [0.25µ] min. Au per MIL-G-4524

over 100µ [2.54] Ni per SAE AMS-QQ-N-290

• CURRENT RATING: 1 amp

• OPERATING TEMPERATURE: 221°F [105°C]

MOUNTING CONSIDERATIONS

• SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.

• Will plug into standard IC socket

18036

Rev. AA

Series 351000

SSOP-to-DIP Adapter

CUSTOMIZATION: In addition to the standard products shown

on this page, Aries specializes in custom design and production.

Special materials, platings, sizes, and configurations can be

furnished, depending on the quantity.

NOTE: Aries reserves the

right to change product general specifications without notice.

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

“A” # OF PINS PER ROW x 0.100 [2.54]

“B” (# OF PINS PER ROW -1) x 0.100 [2.54]

“C” (# OF PADS PER ROW -1) x 0.0256 [0.65]

CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS

No. of Pins

14, 16, 18, 20, 24, 28

Series

ORDERING INFORMATION

XX-351000-10

Plating

10 = Sn/Pb

11 = Au