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12

12 - 174

Pin Number

Function

Description

Interface Schematic

1 - 3, 6, 7, 10 - 13,

16, 18 - 20, 24

N/C

The pins are not connected internally; however, all data

shown herein was measured with these pins connected to

RF/DC ground externally.

4, 5

RFINP, RFINN

RF Input pins Connect RF to RFINP and AC

couple RFINN to ground via 50 Ohm for single

ended operation

8, 9

GND

These pins and the exposed package bottom must be

connected to a high quality RF/DC ground.

Pin Descriptions

Outline Drawing

NOTES:

1. PACKAGE BODY MATERIAL: ALUMINA

2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD

OVER 50 MICROINCHES MINIMUM NICKEL.

3. DIMENSIONS ARE IN INCHES [MILLIMETERS].

4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C-

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE

SOLDERED TO PCB RF GROUND.

7. CLASSIFIED AS MOISTURE SENSITIVITY LEVEL (MSL) 1.

HMC913LC4B

v00.1109

SUCCESSIVE DETECTION LOG VIDEO

AMPLIFIER (SDLVA), 0.6 - 20 GHz