High-frequency Relay

G6W

333

Recommended Soldering Method

■ Temperature Profile According to IRS Method

When performing reflow-soldering, check the profile on an actual device

after setting the temperature condition so that the temperatures at the

relay terminals and the upper surface of the case do not exceed the

limits specified in the following table.

The thickness of cream solder to be applied should be within a range

between 150 and 200

μm on OMRON's recommended PCB pattern.

Visually check that the Relay is properly soldered.

Bottom Ground Soldering Conditions

To solder the bottom ground, manually solder separately from the

terminals according to the following conditions.

• Soldering iron: 50 W

• Iron temperature: 380

°C to 400°C

• Soldering time: 10 s max.

Note: The above conditions are for a PCB with OMRON’s recommended

patterns and hole perforations. The conditions will depend on the

PCB being used. Therefore, it is recommended to double-check

the suitability under actual PCB conditions.

Soldering

Soldering temperature: Approx. 250

°C (At 260°C if the DWS method is

used.)

Soldering time: Approx. 5 s max. (approx. 2 s for the first time and

approx. 3 s for the second time if the DWS method is used.)

Be sure to adjust the level of the molten solder so that the solder will not

overflow onto the PCB.

Precautions

■ Correct Use

Handling

Use the Relay as soon as possible after opening the moisture-proof

package. If the Relay is left for a long time after opening the moisture-

proof package, the appearance may suffer and seal failure may occur

after the solder mounting process. To store the Relay after opening the

moisture-proof package, place it into the original package and sealed the

package with adhesive tape.

When washing the product after soldering the Relay to a PCB, use a

water-based solvent or alcohol-based solvent, and keep the solvent tem-

perature to less than 40

°C. Do not put the Relay in a cold cleaning bath

immediately after soldering.

Dropping the Relay may cause damage to its functional capability.

Never use the Relay if it is dropped.

Protect the Relays from direct sunlight during operation, storage, and

transportation and keep the relays under normal temperature, humidity,

and pressure.

Coating

Do not use silicone coating to coat the Relay when it is mounted to

the PCB. Do not wash the PCB after the Relay is mounted using

detergent containing silicone. Otherwise, the detergent may remain

on the surface of the Relay.

Claw Securing Force During Automatic Insertion

During automatic insertion of Relays, make sure to set the securing force

of the claws to the following values so that the Relay characteristics will

be maintained.

Latching Relay Mounting

Make sure that the vibration or shock that is generated from other

devices, such as relays in operation, on the same panel and imposed on

the Latching Relay does not exceed the rated value, otherwise the Latch-

ing Relay that has been set may be reset or vice versa. The Latching

Relay is reset before shipping. If excessive vibration or shock is imposed,

however, the Latching Relay may be set accidentally. Be sure to apply a

reset signal before use.

Item

Measuring

position

Preheating

(T1 to T2, t

Soldering

(T3, t

Peak value

(T4)

Terminal

150

°C to 180°C,

120 s max.

230

°C min.,

30 s max.

250

°C max.

Upper surface

of case

---

---

255

°C max.

T4

T3

T2

T1

Preheating

Soldering

Time (s)

Relay

Solder

Insufficient

amount of

solder

Excessive

amount of

solder

Terminal

PCB

Land

Correct Soldering

Incorrect Soldering

Secure the claws to the area indicated by shading.

Do not attach them to the center area or to only part of the

Relay.

A

C

B

Direction A: 4.90 N max.

Direction B: 9.80 N max.

Direction C: 9.80 N max.