300

Photomicrosensor (Reflective)

EE-SY125

Precautions

I Soldering Information

Reflow soldering

• Set the reflow oven so that the temperature profile shown in the fol-

lowing chart is obtained for the upper surface of the product being

soldered.

Manual soldering

• Use a soldering iron of less than 25 W, and keep the temperature of

the iron tip at 260

°C or below.

• Solder each point for a maximum of three seconds.

• After soldering, allow the product to return to room temperature

before handling it.

Storage

To protect the product from the effects of humidity until the package

is opened, dry-box storage is recommended. If this is not possible,

store the product under the following conditions:

Temperature: 5 to 30

°C

Humidity: 70% max.

The product is packed in a humidity-proof envelope. Reflow soldering

must be done within 48 hours after opening the envelope, during

which time the product must be stored at 5 to 25

°C at 60% maximum

humidity.

If it is necessary to store the product after opening the envelope, use

dry-box storage or reseal the envelope at 5 to 30

°C at 70% maximum

humidity within two weeks.

Baking

If a product has remained packed in a humidity-proof envelope for six

months or more, or if more than 48 hours have lapsed since the

envelope was opened, bake the product under the following condi-

tions before use only one time:

Bulk: 125

°C for 16 to 24 hours

10 sec. max.

240

°C max.

Time

120 sec. max.

1 to 4

°C/s max.

60 sec. max.

1 to 4

°C/s

max.

90 sec. max.

1 to 4

°C/s

200

°C

165

°C max.