MICROWAVE CORPORATION

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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Visit us at www.hittite.com, or Email at sales@hittite.com

1

HMC323

v01.0701

The circuit board used in the final application should use RF circuit design techniques. Signal lines should have 50 ohm

impedance while the package ground leads should be connected directly to the ground plane similar to that shown. A

sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board

shown is available from Hittite upon request.

Evaluation PCB for HMC323

Evaluation Circuit Board Layout Design Details

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GaAs InGaP HBT MMIC DRIVER

AMPLIFIER, DC - 3.0 GHz