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HMC323 Datasheet(PDF) 5 Page - Hittite Microwave Corporation |
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HMC323 Datasheet(HTML) 5 Page - Hittite Microwave Corporation |
5 / 6 page MICROWAVE CORPORATION 1 - 156 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Visit us at www.hittite.com, or Email at sales@hittite.com 1 HMC323 v01.0701 The circuit board used in the final application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. Evaluation PCB for HMC323 Evaluation Circuit Board Layout Design Details m e t In o i t p i r c s e D 2 J - 1 Jr o t c e n n o C A M S t n u o M C P 1 U3 2 3 C M H * B C P" 5 . 1 x " 5 . 1 B C P n o i t a u l a v E 6 9 1 4 0 1 0 5 3 4 s r e g o R : l a i r e t a M d r a o B t i u c r i C * GaAs InGaP HBT MMIC DRIVER AMPLIFIER, DC - 3.0 GHz |
Similar Part No. - HMC323_01 |
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Similar Description - HMC323_01 |
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