MICROWAVE CORPORATION

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v01.0801

HMC259

The die should be attached directly to the ground

plane eutectically or with conductive epoxy (see HMC

general Handling, Mounting, Bonding Note).

50 Ohm Microstrip transmission lines on 0.127mm

(5 mil) thick alumina thin film substrates are rec-

ommended for bringing RF to and from the chip

(Figure 1). If 0.254mm (10 mil) thick alumina thin film

substrates must be used, the die should be raised

0.150mm (6 mils) so that the surface of the die is

coplanar with the surface of the substrate. One way

to accomplish this is to attach the 0.102mm (4 mil)

thick die to a 0.150mm (6 mil) thick molybdenum heat

spreader (moly-tab) which is then attached to the

ground plane (Figure 2).

MMIC Assembly Techniques for HMC259

Figure 3: Typical HMC259 Assembly

Mounting & Bonding Techiniques for Millimeterwave GaAs MMICs

Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length.

Typical die-to-substrate spacing is 0.076mm (3 mils).

GaAs MMIC SUB-HARMONICALLY

PUMPED MIXER, 28 - 40 GHz