LTC3127



3127f

elecTrical characTerisTics

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: The LTC3127 is guaranteed to meet performance specifications

from 0°C to 85°C. Specifications over the –40°C to 85°C operating

junction temperature range are assured by design, characterization and

correlation with statistical process controls. Note that the maximum

ambient temperature is determined by specific operating conditions in

conjunction with board layout, the rated package thermal resistance and

other environmental factors.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Input Operating Range

l

1.8

5.5

V

Output Voltage Adjust

l

1.8

5.25

V

Feedback Voltage

l

1.165

1.195

1.225

V

Feedback Input Current

1

50

nA

Quiescent Current—Burst Mode Operation

35

µA

Quiescent Current—Shutdown

0.1

4

µA

Quiescent Current—Active

400

µA

Input Current Limit

480

500

520

mA

0°C to 85°C (Note 3)

l

465

500

540

mA

–40°C to 85°C (Note 3)

l

430

500

540

mA

Peak Current Limit

l

2

2.5

A

Reverse-Current Limit

0.15

0.3

0.45

A

P-Channel MOSFET Leakage

Switches A and D

0.1

4

µA

N-Channel MOSFET On-Resistance

Switch B

Switch C

140

170

mΩ

mΩ

P-Channel MOSFET On-Resistance

Switch A

Switch D

160

190

mΩ

mΩ

Maximum Duty Cycle

Boost( % Switch C On)

Buck (% Switch A On)

l

l

80

100

90

%

%

Minimum Duty Cycle

l

0

%

Frequency Accuracy

l

1

1.35

1.7

MHz

SHDN Input High Voltage

l

1.2

V

SHDN Input Low Voltage

l

0.3

V

SHDN Input Current

0.01

1

µA

MODE Input High Voltage

l

1.2

V

MODE Input Low Voltage

l

0.3

V

MODE Input Current

0.01

1

µA

Note 3: Specification is guaranteed when the inductor current is in

continuous conduction.

Note 4: Current measurements are made when the output is not

switching.

Note 5: This IC includes overtemperature protection that is intended

to protect the device during momentary overload conditions. Junction

temperature will exceed 125°C when overtemperature protection is active.

Continuous operation above the specified maximum operating junction

temperature may result in device degradation or failure.

Note 6: Failure to solder the exposed backside of the package to the PC

board ground plane will result in a thermal resistance much higher than

40°C/W.