PRELIMINARY DATA SHEET • SKY73134 FREQUENCY SYNTHESIZER

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

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December 15, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201199A

Table 7. SKY73134 Electrical Specifications: Phase Noise Performance (3 of 3) (Note 1)

Parameter

Symbol

Test Condition

Min

Typical

Max

Units

VCO Divided by 4

Phase noise:

@ 1 kHz

@ 10 kHz

@ 100 kHz

@ 1 MHz

VCO – 12

VCO – 12

VCO – 12

VCO – 12

dBc/Hz

dBc/Hz

dBc/Hz

dBc/Hz

VCO Divided by 8

Phase noise:

@ 1 kHz

@ 10 kHz

@ 100 kHz

VCO – 18

VCO – 18

VCO – 18

dBc/Hz

dBc/Hz

dBc/Hz

Note 1: Performance is guaranteed only under the conditions listed in this Table.

Evaluation Board Description

The SKY73134 Evaluation Board is used to test the performance

of the SKY73134 frequency synthesizer. An assembly drawing for

the Evaluation Board is shown in Figure 8 and the layer detail is

provided in Figure 9. A schematic diagram of the SKY73134

Evaluation Board is shown in Figure 10.

Circuit Design Configurations

The following design considerations are general in nature and

must be followed regardless of final use or configuration:

1. Paths to ground should be made as short as possible.

2. The ground pad of the SKY73134 has special electrical and

thermal grounding requirements. This pad is the main thermal

conduit for heat dissipation. Since the circuit board acts as

the heat sink, it must shunt as much heat as possible from

the device. Therefore, design the connection to the ground

pad to dissipate the maximum wattage produced by the

circuit board.

3. Skyworks recommends including external bypass capacitors

on the VCC voltage inputs of the device.

*** add’l info TBD ***

Package Dimensions

The PCB layout footprint for the SKY73134 is provided in

Figure 11. Figure 12 shows the package dimensions for the

25-pin LGA and Figure 13 provides the tape and reel dimensions.

Package and Handling Information

Since the device package is sensitive to moisture absorption, it is

baked and vacuum packed before shipping. Instructions on the

shipping container label regarding exposure to moisture after the

container seal is broken must be followed. Otherwise, problems

related to moisture absorption may occur when the part is

subjected to high temperature during solder assembly.

THE SKY73134 is rated to Moisture Sensitivity Level 3 (MSL3) at

260 C. It can be used for lead or lead-free soldering. For

additional information, refer to the Skyworks Application Note,

PCB Design & SMT Assembly/Rework Guidelines for RFLGA

Packages, document number 103147.

Care must be taken when attaching this product, whether it is

done manually or in a production solder reflow environment.

Production quantities of this product are shipped in a standard

tape and reel format. For packaging details, refer to the Skyworks

Application Note, Tape and Reel Information – RF Modules,

document number 101568.