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MAX883EPA Datasheet(PDF) 10 Page - Maxim Integrated Products |
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MAX883EPA Datasheet(HTML) 10 Page - Maxim Integrated Products |
10 / 17 page 5V/3.3V or Adjustable, Low-Dropout, Low IQ, 200mA Linear Regulators 10 ______________________________________________________________________________________ The GND pins of the MAX882/MAX883/MAX884 SOIC package perform the dual function of providing an elect- rical connection to ground and channeling heat away. Con- nect all GND pins to ground using a large pad or ground plane. Where this is impossible, place a copper plane on an adjacent layer. For a given power dissipation, the pad should exceed the associated dimensions in Figure 4. Figure 4 assumes the IC is in an 8-pin small-outline pack- age that has a maximum junction temperature of +125°C and is soldered directly to the pad; it also has a +25°C ambient air temperature and no other heat sources. Use larger pad sizes for other packages, lower junction tem- peratures, higher ambient temperatures, or conditions where the IC is not soldered directly to the heat-sinking ground pad. When operating C- and E-grade parts up to a TJ of +125°C, expect performance similar to M-grade specifications. For TJ between +125°C and +150°C, the output voltage may drift more. The MAX882/MAX883/MAX884 can regulate currents up to 250mA and operate with input voltages up to 11.5V, but not simultaneously. High output currents can only be sus- tained when input-output differential voltages are small, as shown in Figure 5. Maximum power dissipation depends on packaging, temperature, and air flow. The maximum output current is as follows: where P is derived from Figure 4. I P(T T ) (V V )100 C OUT(MAX) JA IN OUT = − −° 1.0 0.9 1.6 1.5 1.4 1.3 1.2 1.1 0.1cm2 0.0155in2 1cm2 0.155in2 10cm2 1.55in2 100cm2 15.5in2 COPPER GROUND PAD AREA MAX883, VOUT = 5V 8-PIN SO PACKAGE 77.4cm2, SINGLE-SIDED BOARD 1oz COPPER GLASS EPOXY, TJ = +125 °C, TA = +25 °C, STILL AIR 250 200 150 100 50 0 SUPPLY VOLTAGE (V) 5 4 3 27 68 10 911 13 12 MAXIMUM POWER DISSIPATION LIMIT HIGH- POWER SOIC PLASTIC DIP CERAMIC DIP MAXIMUM CURRENT OPERATING REGION AT TA = +25°C TJ = +125°C 250 200 150 100 50 0 SUPPLY VOLTAGE (V) 5 47 68 10 911 13 12 MAXIMUM POWER DISSIPATION LIMIT HIGH- POWER SOIC PLASTIC DIP CERAMIC DIP MAXIMUM CURRENT OPERATING REGION AT TA = +25°C TJ = +125°C Figure 4. Typical Maximum Power Dissipation vs. Ground Pad Area Figure 5a. Safe Operating Regions: MAX882/MAX884 Maximum Output Current vs. Supply Voltage Figure 5b. Safe Operating Regions: MAX883 Maximum Output Current vs. Supply Voltage |
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