CHA4042 datasheet(4/6 Pages) UMS

Part #	CHA4042

Description	23-34GHz High Power Amplifier

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Manufacturer	UMS [United Monolithic Semiconductors]

Direct Link	http://www.ums-gaas.com

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4 / 6 page

CHA4042

23-34GHz High Power Amplifier

Ref. : DSCHA40422218 -06-Aug.-02

4/6

Specifications subject to change without notice

Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE

Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

Units: millimeters

Thickness: 0.070

Bond Pad #1, 7, 9: GND

(0.080 x 0.080)

Bond Pad #4, 5, 11: GND

(0.080 x 0.090)

Bond Pad #14: GND

(0.122 x 0.080)

Bond Pad #2:

VG1

(0.100 x 0.150)

Bond Pad #3:

VG2

(0.100 x 0.150)

Bond Pad #6:

VG3

(0.100 x 0.100)

Bond Pad #8:

RF OUT

(0.100 x 0.260)

Bond Pad #10: VD3

(0.100 x 0.100)

Bond Pad #12: VD2

(0.100 x 0.100)

Bond Pad #13: VD1

(0.100 x 0.100)

Bond Pad #15: RF IN

(0.100 x 0.200)

.000

.467

.240

.338

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

1.090

MMIC Outline & Bond Pads

Not to scale, dimensions are in millimeters

Chip size : 1930µm +/-35µm x 1090µm +/- 35µm

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CHA4042 Datasheet(PDF) 4 Page - United Monolithic Semiconductors

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