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AS1371-BTDT-105 Datasheet(PDF) 10 Page - ams AG |
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AS1371-BTDT-105 Datasheet(HTML) 10 Page - ams AG |
10 / 14 page www.austriamicrosystems.com Revision 1.04 10 - 14 AS1371 Datasheet - D e t a i l e d D e s c r i p t i o n Operating Region and Power Dissipation Maximum power dissipation is determined by the thermal resistance of the case and circuit board, the temperature difference between the die junction and ambient air, and the rate of air flow. The power dissipation of the device is calculated by: Maximum power dissipation is calculated by: Where: TJ - TAMB is the temperature difference between the device die junction and the surrounding air. θJB is the thermal resistance of the package. θJA is the thermal resistance through the circuit board, copper traces, and other materials to the surrounding. Note: Pin GND is a multi-function pin providing a connection to the system ground and acting as a heat sink. This pin should be connected to the system ground using a large pad or a ground plane. (EQ 2) PI OUT V IN V OUT – () × = (EQ 3) P MAX T J T AMB – θ JB θ JA + ------------------------- = |
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