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TMS320C5515AZCHA10 Datasheet(PDF) 1 Page - Texas Instruments |
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TMS320C5515AZCHA10 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 153 page TMS320C5515 www.ti.com SPRS645 – JANUARY 2010 TMS320C5515 Fixed-Point Digital Signal Processor Check for Samples: TMS320C5515 1 Fixed-Point Digital Signal Processor 1.1 TMS320C5515 Features 1 (4 Blocks of 16K x 16-Bit) • HIGHLIGHTS: • 4M x 16-Bit Maximum Addressable External • High-Perf/Low-Power, C55x™ Fixed-Point DSP Memory Space (SDRAM/mSDRAM) – 16.67/13.33/10/8.33-ns Instruction Cycle Time • 16-/8-Bit External Memory Interface (EMIF) with – 60-, 75-, 100-, 120-MHz Clock Rate Glueless Interface to: • 320K Bytes On-Chip RAM – 8-/16-Bit NAND Flash, 1- and 4-Bit ECC • 16-/8-Bit External Memory Interface (EMIF) – 8-/16-Bit NOR Flash • Two MultiMedia Card/Secure Digital I/Fs – Asynchronous Static RAM (SRAM) • Serial-Port I/F (SPI) With Four Chip-Selects – SDRAM/mSDRAM (1.8-, 2,5-, and 3.3-V) • Four Inter-IC Sound (I2S Bus™) • Direct Memory Access (DMA) Controller • USB 2.0 Full- and High-Speed Device – Four DMA With 4 Channels Each • LCD Bridge With Asynchronous Interface (16-Channels Total) • Tightly-Coupled FFT Hardware Accelerator • Three 32-Bit General-Purpose Timers • 10-Bit 4-Input SAR ADC – One Selectable as a Watchdog and/or GP • Real-Time Clock (RTC) With Crystal Input • Two MultiMedia Card/Secure Digital (MMC/SD) • Four Core Isolated Power Supply Domains Interfaces • Four I/O Isolated Power Supply Domains • Universal Asynchronous Receiver/Transmitter • Three integrated LDOs (UART) • Industrial Temperature Devices Available • Serial-Port Interface (SPI) With Four • 1.05-V Core, 1.8/2.5/2.8/3.3-V I/Os Chip-Selects • 1.3-V Core, 1.8/2.5/2.8/3.3-V I/Os • Master/Slave Inter-Integrated Circuit (I2C Bus™) • FEATURES: • Four Inter-IC Sound (I2S Bus™) for Data Transport • High-Performance, Low-Power, TMS320C55x™ Fixed-Point Digital Signal Processor • Device USB Port With Integrated 2.0 High-Speed PHY that Supports: – 16.67-, 13.33, 10-, 8.33-ns Instruction Cycle Time – USB 2.0 Full- and High-Speed Device – 60-, 75-, 100-, 120-MHz Clock Rate • LCD Bridge With Asynchronous Interface – One/Two Instruction(s) Executed per Cycle • Tightly-Coupled FFT Hardware Accelerator – Dual Multipliers [Up to 200 or 240 Million • 10-Bit 4-Input Successive Approximation (SAR) Multiply-Accumulates per Second (MMACS)] ADC – Two Arithmetic/Logic Units (ALUs) • Real-Time Clock (RTC) With Crystal Input, With Separate Clock Domain, Separate Power – Three Internal Data/Operand Read Buses Supply and Two Internal Data/Operand Write Buses • Four Core Isolated Power Supply Domains: – Fully Software-Compatible With C55x Analog, RTC, CPU and Peripherals, and USB Devices • Four I/O Isolated Power Supply Domains: RTC – Industrial Temperature Devices Available I/O, EMIF I/O, USB PHY, and DVDDIO • 320 K Bytes Zero-Wait State On-Chip RAM, • Three integrated LDOs (DSP_LDO, ANA_LDO, Composed of: and USB_LDO) to power the isolated domains: – 64K Bytes of Dual-Access RAM (DARAM), DSP Core, Analog, and USB Core, respectively 8 Blocks of 4K x 16-Bit • Low-Power S/W Programmable Phase-Locked – 256K Bytes of Single-Access RAM (SARAM), Loop (PLL) Clock Generator 32 Blocks of 4K x 16-Bit • On-Chip ROM Bootloader (RBL) to Boot From • 128K Bytes of Zero Wait-State On-Chip ROM 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCT PREVIEW information concerns products in the formative Copyright © 2010, Texas Instruments Incorporated or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. |
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