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SKHC Datasheet(PDF) 4 Page - ALPS ELECTRIC CO.,LTD. |
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SKHC Datasheet(HTML) 4 Page - ALPS ELECTRIC CO.,LTD. |
4 / 5 page Snap-in Type Surface Mount Type Radial Type TACT Switch TM Sharp Feeling Soft Feeling 306 Detector Push Slide Rotary Encoders Power Dual-in-line Package Type Custom- Products TACT SwitchTM 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 φ CA(K)or CC(T)at solder joints(copper foil surface). A heat resistive tape should be used to fix thermocouple. 3. Temperature profile Soldering Conditions Condition for Reflow Available for Surface Mount Type. 180 150 260˚C max. 3 sec max. 230˚C Time 120 sec max.(pre-heating ) 3 to 4min. Time inside soldering equipment Temperature (˚C ) 40s max. Manual Soldering (Except SKRT Series) Flux built-up Mounting surface should not be exposed to fluk Ambient temperature of the soldered surface of PC board. 100 ℃ max. 60s max. 260 ℃ max. 5s max. Preheating temperature Preheating time Soldering temperature Duration of immersion Items Condition Condition 2times max. Number of soldering Soldering temperature 350 ℃max. 3s max. Duration of soldering 60W max. Capacity of soldering iron Items 1. Consult with us for availability of TACT Switch TM washing. 2. Prevent flux penetration from the top side of the TACT Switch TM. 3. Switch terminals and a PC board should not be coated with flux prior to soldering. 4. The second soldering should be done after the switch is stable with normal temperature. 5. Use the flux with a specific gravity of min 0.81. (EC-19S-8 by TAMURA Corporation, or equivalents.) Notes Conditions for Auto-dip Available for Snap-in Type and Radial Type (Except SKHJ, SKHL, SKQJ, SKQK, SKEG series) 1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the material, size, thickness of PC boards and others. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. Note |
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