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SE97 Datasheet(PDF) 6 Page - NXP Semiconductors

Part # SE97
Description  DDR memory module temp sensor with integrated SPD, 3.3 V
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

SE97 Datasheet(HTML) 6 Page - NXP Semiconductors

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SE97_7
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 07 — 29 January 2010
6 of 55
NXP Semiconductors
SE97
DDR memory module temp sensor with integrated SPD, 3.3 V
6.2 Pin description
Table 2.
Pin description
Symbol
Pin
Type
Description
A0
1
I
I2C-bus/SMBus slave address bit 0 with internal pull-down. This
input is overvoltage tolerant to support software write protection.
A1
2
I
I2C-bus/SMBus slave address bit 1 with internal pull-down
A2
3
I
I2C-bus/SMBus slave address bit 2 with internal pull-down
VSS
4
ground
device ground
SDA
5
I/O
SMBus/I2C-bus serial data input/output (open-drain). Must have
external pull-up resistor.
SCL
6
I
SMBus/I2C-bus serial clock input/output (open-drain). Must have
external pull-up resistor.
EVENT
7
O
Thermal alarm output for high/low and critical temperature limit
(open-drain). Must have external pull-up resistor.
VDD
8
power
device power supply (3.0 V to 3.6 V); supports 1.7 V for
EEPROM read only.


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