© Coilcraft, Inc. 2009
Specifications subject to change without notice.
Please check our website for latest information.
Shielded PowerInductors–XPL4020
Document 683-1
Document 683-1
Revised 10/15/09
Inductance
DCR3
SRF
Isat (A)5
Irms (A)6
±20%2
(mOhms)
typ4
10%
20%
20°C 40°C
Part number1
(µH)
typ
max
(MHz)
drop
drop
rise
rise
XPL4020-271ML_
0.27
13.1
14.4
205
6.8
11.2
7.3
9.9
XPL4020-471ML_
0.47
18.7
20.6
126
5.8
9.0
5.4
7.2
XPL4020-681ML_
0.68
23.0
25.3
99
4.8
7.8
5.1
6.7
XPL4020-102ML_
1.0
29.1
32.0
66
4.0
6.5
4.5
6.1
XPL4020-152ML_
1.5
36.4
40.0
61
3.6
5.8
4.0
5.4
XPL4020-222ML_
2.2
60.0
66.0
39
2.6
4.1
3.1
4.2
XPL4020-332ML_
3.3
85.7
94.3
34
2.4
3.8
2.6
3.5
XPL4020-472ML_
4.7
130.5
143.6
26
1.9
3.0
2.1
2.9
XPL4020-682ML_
6.8
197.6
217.4
23
1.6
2.5
1.8
2.5
XPL4020-822ML_
8.2
213.9
235.3
19
1.4
2.2
1.7
2.3
XPL4020-103ML_
10
300.0
330.0
17
1.3
2.0
1.4
2.0
1. When ordering, please specify packaging code:
XPL4020-103ML
C
Packaging: C =7
″ machine-ready reel. EIA-481
embossed plastic tape (1000 parts per
full reel).
B = Less than full reel. In tape, but not
machine ready. To have a leader and
trailer added ($25 charge), use code
letter C instead.
D =13
″ machine-ready reel. EIA-481
embossed plastic tape. Factory order
only, not stocked (3500 parts per full
reel).
2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.
3. DCR measured on a micro-ohmmeter.
4. SRF measured using Agilent/HP 4395A or equivalent.
5. DC current at which the inductance drops the specified
amount from its value without current.
6. Current that causes the specified temperature rise from
25°C ambient.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components”
before soldering.
Designer’s Kit C432 contains 3 each of all values
Terminations RoHS compliant matte tin over nickel over copper.
Other terminations available at additional cost.
Weight 0.16 g – 0.18 g
Ambient temperature –40°C to +125°C. The part can be operated
without damage as long as the part (ambient temperature plus
temperature rise due to self heating) does not exceed +165°C.
Storage temperature Component: –40°C to +165°C.
Packaging: –40°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Failures in Time (FIT) / Mean Time Between Failures (MTBF)
38 per billion hours / 26,315,789 hours, calculated per Telcordia SR-332
Packaging 1000/7
″reel; 3500/13″ reel Plastic tape: 12 mm wide,
0.23 mm thick, 8 mm pocket spacing, 2.3 mm pocket depth
PCB washing Only pure water or alcohol recommended
• Excellent current handling, low DCR and soft saturation
makes them ideal for VRM/VRD applications
• Large terminations provide low resistance, excellent ther-
mal management and the best possible board adhesion
Irms Testing
Irms testing was performed on 0.75 inch wide × 0.25 inch
thick copper traces in still air.
Temperature rise is highly dependent on many factors
including pcb land pattern, trace size, and proximity to
other components. Therefore temperature rise should
be verified in application conditions.
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