2.2MHz, Dual, Step-Down DC-DC

Converters, Dual LDOs, and

RESET

2

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ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

PV1, EN to GND .....................................................-0.3V to +45V

LX1 to GND.................................................-0.5V to (PV1 + 0.3V)

LX2 to GND.................................................-0.5V to (PV2 + 0.3V)

BST to LX1.............................................................-0.3V to +6.0V

PV2, PV3, PV4, OUTS1, PWM, RESET to GND_....-0.3V to +6.0V

OUTS2 .......................................................-0.3V to (PV2 + 0.3V)

OUT3 .........................................................-0.3V to (PV3 + 0.3V)

OUT4 .........................................................-0.3V to (PV4 + 0.3V)

LX1 RMS Current .................................................................2.0A

LX2 RMS Current .................................................................1.2A

PGND2 to GND_....................................................-0.3V to +0.3V

LSUP to GND............................................................-0.3V to +6V

OUTS_, OUT_ Output Short-Circuit Duration .............Continuous

20-Pin TQFN-EP (derate 31.3 mW/°C above +70°C)....... 2500mW

20-Pin TSSOP-EP (derate 26.5 mW/°C above +70°C)..... 2122mW

Junction-to-Case Thermal Resistance (

20-Pin TQFN-EP .......................................................... 2.7°C/W

20-Pin TSSOP-EP ........................................................... 2°C/W

Junction-to-Ambient Thermal Resistance (

20-Pin TQFN-EP ........................................................... 32°C/W

20-Pin TSSOP-EP ..................................................... 37.7°C/W

Operating Temperature Range .........................-40°C to +125°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

OUT1—SYNCHRONOUS STEP-DOWN DC-DC CONVERTER

(Note 3)

3.7

28

Supply-Voltage Range

Operation < 500ms

45

V

PV1 rising

3.7

4.0

PV1 Undervoltage Lockout

PV1 falling

2.9

3.3

V

BST Refresh Load Enable

PV1 falling (option enabled)

5.7

V

BST Refresh Load Hysteresis

0.25

V

LSUP Regulator Voltage

6V

4.75

5.0

5.25

V

Supply Current

EN = low

5

µA

PWM Switching Frequency

Internally generated

2.0

2.2

2.4

MHz

Duty cycle = 20% to 90%;

-3

+3

Voltage Accuracy

SKIP mode (Note 4)

-2

+4

%

DMOS On-Resistance

300

700

m

Ω

Current-Limit Threshold

1.4

1.75

2.1

A

Soft-Start Ramp Time

2.2

ms

Maximum Output Current

1.2

A

LX1 Leakage Current

±1

µA

Maximum Duty Cycle

97

%

Minimum Duty Cycle

20

%

OUTS1 Discharge Resistance

EN = low (or optionally EN = high and

70

Ω