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MAX5969A Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX5969A Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 14 page IEEE 802.3af/at-Compliant, Powered Device Interface Controllers with Integrated Power MOSFET 2 ______________________________________________________________________________________ Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. VDD to VSS ..........................................................-0.3V to +100V DET, RTN, WAD, PG, 2EC to VSS .......................-0.3V to +100V CLS to VSS ..............................................................-0.3V to +6V Maximum Current on CLS (100ms maximum).................100mA Continuous Power Dissipation (TA = +70NC) (Note 1) 10-Pin TDFN (derate 24.4mW/NC above +70NC) Multilayer Board ........................................................1951mW Package Thermal Resistance (Note 2) B JA.................................................................................4NC/W B JC ................................................................................9NC/W Operating Temperature Range.......................... -40NC to +85NC Maximum Junction Temperature.....................................+150NC Storage Temperature Range............................ -65NC to +150NC Soldering Temperature (reflow) .................................... +260NC ELECTRICAL CHARACTERISTICS (VIN = (VDD - VSS) = 48V, RDET = 24.9kω, RCLS = 615ω. RTN, WAD, PG, and 2EC unconnected, all voltages are referenced to VSS, unless otherwise noted. TA = TJ = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Note 3) ABSOLUTE MAXIMUM RATINGS Note 1: Maximum power dissipation is obtained using JEDEC JESD51-5 and JESD51-7 specifications. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DETECTION MODE Input Offset Current IOFFSET VIN = 1.4V to 10.1V (Note 4) 10 F A Effective Differential Input Resistance dR VIN = 1.4V up to 10.1V with 1V step, VDD = RTN = WAD = PG = 2EC (Note 5) 23.95 25.00 25.5 kI CLASSIFICATION MODE Classification Disable Threshold VTH,CLS VIN rising (Note 6) 22.0 22.8 23.6 V Classification Stability Time 0.2 ms Classification Current ICLASS VIN = 12.5V to 20.5V, VDD = RTN = WAD = PG = 2EC Class 0, RCLS = 619I 0 3.96 mA Class 1, RCLS = 117I 9.12 11.88 Class 2, RCLS = 66.5I 17.2 19.8 Class 3, RCLS = 43.7I 26.3 29.7 Class 4, RCLS = 30.9I 36.4 43.6 Class 5, RCLS = 21.3I 52.7 63.3 TYPE 2 (802.3at) CLASSIFICATION MODE Mark Event Threshold VTHM VIN falling 10.1 10.7 11.6 V Hysteresis on Mark Event Threshold 0.84 V Mark Event Current IMARK VIN falling to enter mark event, 5.2V P VIN P 10.1V 0.25 0.85 mA Reset Event Threshold VTHR VIN falling 2.8 4 5.2 V POWER MODE VIN Supply Voltage Range 60 V VIN Supply Current IQ Measured at VDD 0.27 0.55 mA |
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