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SS1307151ML Datasheet(PDF) 1 Page - ABC Taiwan Electronics Corp |
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SS1307151ML Datasheet(HTML) 1 Page - ABC Taiwan Electronics Corp |
1 / 6 page 50sec max. 200 Forced Cooling Area -(1.0 ~ 5.0) / sec max. ℃ m/m m/m m/m m/m m/m m/m SS1307□□□□L□-□□□ a﹒Core:Ferrite DR core f﹒Remark:Products comply with RoHS' d﹒Plastic : GAP Specer a﹒Temp. rise :40℃ typ. c﹒Wire :Enamelled copper wire (class F) Ⅳ﹒ GENERAL SPECIFICATION: b﹒Core:Ferrite RI core e﹒Terminal:Ag/Ni/Sn e﹒Resistance to solder heat:260℃.10 secs. c﹒Storage temp.:-40℃ ----+125℃ d﹒Operating temp.:-40℃----+105℃ b﹒Rated current:Base on temp. rise AE-001A Max time above 200℃ :70sec max. Max time above 230℃ :50sec max. Peak Temp:260℃ max. & L / LOA=10% typ. △ requirements 250 100 0 50 50 150 200 Time ( seconds ) 150 100 70sec max. 150 ~ 200 / 60 ~ 120sec ℃ Preheat Area Rising Area +4.0 / sec max. ℃ Temperature e Reflow Area / sec max. +2.0 ~ 4.0℃ d c SHIELDED SMD POWER INDUCTOR Ⅰ﹒ CONFIGURATION & DIMENSIONS: Ⅲ﹒ MATERIALS: Ⅱ﹒ SCHEMATIC DIAGRAM: Marking PROD. NAME REF : C ( PCB Pattern ) a b D SPECIFICATION FOR APPROVAL ABC'S ITEM NO. ABC'S DWG NO. A : 13.0±0.3 B : 7.0±0.3 C : 5.0 typ. D : 14 .0 ref. F : 4.5 ref. E : 14.0 ref. 260℃ 250 230℃ Peak Temperature: PAGE: 1 |
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