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JHW250S30R21-18TZ Datasheet(PDF) 11 Page - Lineage Power Corporation |
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JHW250S30R21-18TZ Datasheet(HTML) 11 Page - Lineage Power Corporation |
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11 / 14 page  Data Sheet October 6, 2005 JHW250S30R2 Power Module; dc-dc Converter 36 – 75 Vdc Input; 30.2Vdc Output; 250W Tyco Electronics Power Systems 11 Feature Descriptions (continued) 0 50 100 150 200 250 300 20 30 40 50 60 70 80 90 100 110 Thermal Considerations The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation of the unit. Heat-dissipating components inside the unit are thermally coupled to the metal case. Heat is removed by conduction, convection, and radiation to the surrounding environment. Proper cooling can be verified by measuring the case temperature. Peak temperature (TC) occurs at the position indicated in Figure 20. CASE TEMPERATURE, T Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. C (°C) Figure 21. Output Power Derating for JHW250S30R2 (Vo = 30.2V) vs Case Temperature Layout Considerations For reliable operation please refer to the power derating guidelines shown in figure 21. Under no circumstances should the absolute maximum temperature at this point exceed the 100°C threshold. The JHW250 power module series are encapsulated aluminum case packaged style, as such; component clearance between the bottom of the power module and the mounting (Host) board is limited. Avoid placing copper areas on the outer layer directly underneath the power module. Also avoid placing via interconnects underneath the power module. MEASURE CASE TEMPERATURE HERE (Tc) VI(-) ON/OFF CASE + SEN TRIM - SEN VI(+) VO(-) VO(+) 30.5 (1.20) 29.0 (1.14) For additional layout guide-lines, refer to FLTR100V20 data sheet. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Tyco Electronics Board Mounted Power Modules: Soldering and Cleaning Application Note (AP01-056EPS). Figure 20. Metal Case (Tc ) Temperature Measurement Location (top view) Although the maximum Tc temperature of the power modules is 100°C, you can limit this temperature to a lower value for extremely high reliability. |
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