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EHW015A0A1 Datasheet(PDF) 10 Page - Lineage Power Corporation |
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EHW015A0A1 Datasheet(HTML) 10 Page - Lineage Power Corporation |
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10 / 19 page  Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current LINEAGE POWER 10 Thermal Considerations (continued) 0 2 4 6 8 10 12 14 16 20 30 40 50 60 70 80 90 1.0 m/s (200 LFM) 2.0 m/s (400 LFM) 0.5 m/s (100 LFM) NC AMBIENT TEMEPERATURE, TA ( oC) Figure 19. Output Current Derating for the Module with Heatplate and 1.0 in. heat sink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. Please refer to the Application Note “Thermal Characterization Process For Open-Frame Board- Mounted Power Modules” for a detailed discussion of thermal aspects including maximum device temperatures. Heat Transfer via Conduction The module can also be used in a sealed environment with cooling via conduction from the module’s top surface through a gap pad material to a cold wall, as shown in Figure 20. The output current derating versus cold wall temperature, when using a gap pad such as Bergquist GP2500S20, is shown in Figure 21. Figure 20. Cold Wall Mounting 2 4 6 8 10 12 14 16 20 30 40 50 60 70 80 90 COLDPLATE TEMEPERATURE, TC ( oC) Figure 21. Derated Output Current versus Cold Wall Temperature with local ambient temperature around module at 85C; Vin=48V. Surface Mount Information Pick and Place The EHW015A0A-S modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures of up to 300 oC. The label also carries product information such as product code, serial number and the location of manufacture. Figure 23. Pick and Place Location. Nozzle Recommendations The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. The surface mountable modules in the EHW family use our newest SMT technology called “Column Pin” (CP) connectors. Figure 24 shows the new CP connector before and after reflow soldering onto the end-board assembly. EHW Boa rd In su lato r Solde r Ba ll End assem bly PCB Figure 24. Column Pin Connector Before and After Reflow Soldering . |
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