TQ6122

9

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0.65

SQUARE

0.015

0.060

0.125

0.805

NOMINAL

0.005

TOP VIEW

PIN 12

0.035

All Dimensions in Inches

PIN 1

0.050

Figure 11. Mounting Footprint

Figure 10. Package Dimensions

Package Outline

(For Reference Only)

PIN 12

PIN 23

0.350

0.425

All Dimensions in Inches

PIN 34

SOLDER PAD

0.050

0.025

PIN 1

Figure 12. Heat-Sink Mounting Arrangement (heat sink not included)

THERMALLOY TYPE 2291C TOP

THERMALLOY

TYPE 2291C

BASE

THERMAL

ADHESIVE

DAC IC

Use Loctite “Output” Thermal

Conductive Adhesive (Loctite item

number 00241) or equivalent to

attach heat sink base to IC.