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CB2012UK121 Datasheet(PDF) 4 Page - SAMWHA ELECTRIC |
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CB2012UK121 Datasheet(HTML) 4 Page - SAMWHA ELECTRIC |
4 / 8 page SAMWHA ELECTRONICS CO., LTD Reliability & Test Condition http://www.samwha.com/chip This description in the this catalogue is subject to change without notice Temperature : 125 ± 3 ℃ Applied current : rated current Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours High temperature load resistance Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Humidity resistance Preheat temperature : 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 sec. max. (Reflow soldering profile) More than 50% of the terminal electrode shall be covered with new solder Reflow soldering at packing condition 40 ℃ max., 70% RH max. Storage temperature range Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 ± 1 sec. More than 90% of the terminal electrode shall be covered with new solder Solderability Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 270 ± 10 ℃ Soldering time : 10 ± 0.5 sec. 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than ±30 % Resistance to soldering heat Temperature : 125 ± 3 ℃ Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours 1. No mechanical damage 2. Impedance shall not change more than ±30 % High temperature resistance - - 55 ℃ ~ + 125 ℃ Operating temperature range Test Conditions Requirements Item ST ≥ CT 1 2 CT ST DPS-081104 CHIP BEADS |
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