TYPE

SMV1210M

PAGE

5/9

CITATION

DATE

Feb. 03, 2009

SUBJECT

Soldering

REV.

C01

5. SOLDERING RECOMMENDATIONS

5.1 Recommended solder pad layout

A

B

C

D

1.8~2.5

4.2~5.2

2.2~3.0

1.3~2.0

（

Unit：mm）

5.2 The SIR test of the solder paste shall be done（Based on JIS-Z-3284）

5.3 Steel plate and foot distance printing

Foot distance printing (mm)

Steel Plate thickness (mm)

> 0.65mm

0.18mm

0.65mm~0.5mm

0.15mm

0.50mm~0.40mm

0.12mm

<=0.40 mm

0.10mm

5.4 IR Soldering

Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and

gradual cooling process is suggested. IR soldering has the highest yields due to controlled heating rates and

solder liquids times. Make sure that the element is not 2.4 The IR reflow and temperature of Soldering for Pb

Free subjected to a thermal gradient steeper than 4 degrees per second. 2 degrees per second is the ideal

gradient. During the soldering process, pre- heating to within 100 degrees of the solders peak temperature is

essential to minimize thermal shock.