TYPE

SMV0603M

PAGE

6/9

CITATION

DATE

Feb. 03, 2009

SUBJECT

Soldering

REV.

C01

☆

IR reflow Pb Free Process suggestion profile

(1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150μm

(2) Ramp-up rate (217℃ to Peak) + 3℃/second max

(3) Temp. maintain at 175 +/-25℃ 180 seconds max

(4) Temp. maintain above 217 ℃ 60-150 seconds

(5) Peak temperature range 245℃ +20℃/ -10 ℃ time within 5 ℃of actually peak temperature (tp) 10~20

seconds

(6) Ramp down rate +6 ℃/second max.

※

Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of the

manufacturing process, and the specification of the reflow furnace.

5.5 Resistance to soldering heat-High Temperature Resistance:260℃,10sec-3times.

5.6 Hand Soldering

In hand soldering of the Varistors. Large temperature gradient between preheated the Varistors and the tip of

soldering iron may cause electrical failures and mechanical damages such as crackings or breakings of the

devices. The soldering shall be carefully controlled and carried out so that the temperature gradient is kept

minimum with following recommended conditions for hand soldering.

5.6.1 Recommended Soldering Condition 1

（

1） Solder ：

0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with soldering flux in the core. Rosin-based and

non-activated flux is recommended.

（

2） Preheating

The Varistors shall be preheated so that Temperature Gradient between the devices and the tip of

soldering iron is 150℃ or below.