MCIMX25_09 datasheet(1/132 Pages) FREESCALE

Part #	MCIMX25

Description	i.MX25 Applications Processor for Consumer and Industrial Products

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Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

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Freescale Semiconductor

Data Sheet: Advance Information

Document Number: IMX25CEC

Rev. 2, 12/2009

MCIMX25

Package Information

Plastic package

Case 5284 17 x 17 mm, 0.8 mm Pitch

Ordering Information

See Table 1 on page 3 for ordering information.

1

Introduction

The i.MX25 multimedia applications processor has

the right mix of high performance, low power, and

integration to support the growing needs of the

industrial and general embedded markets.

At the core of the i.MX25 is Freescale's fast,

proven, power-efficient implementation of the

ARM926EJ-S core, with speeds of up to 400 MHz.

The i.MX25 includes support for up to 133-MHz

DDR2 memory, integrated 10/100 Ethernet MAC,

and two on-chip USB PHYs. The device is suitable

for a wide range of applications, including the

following:

•

Graphical remote controls

•

Human machine interface (HMI)

•

Residential and commercial control panels

•

Residential gateway (smart metering)

•

Handheld scanners and printers

i.MX25 Applications

Processor for Consumer

and Industrial Products

Silicon Version 1.1

1

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.1

Special Signal Considerations . . . . . . . . . . . . . . . . . 8

3

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.1

i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 10

3.2

Supply Power-Up/Power-Down Requirements and

Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

3.3

Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . 16

3.4

I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 17

3.5

AC Electrical Characteristics . . . . . . . . . . . . . . . . . 22

3.6

Module Timing and Electrical Parameters . . . . . . . 40

4

Package Information and Contact Assignment . . . . . . . 121

4.1

400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 121

4.2

Ground, Power, Sense, and Reference Contact

Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

4.3

Signal Contact Assignments—17x17mm,

0.8mm Pitch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124

4.4

i.MX25 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 127

5

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129

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