4. DIMENSION

5. ENVIRONMENTAL CHARACTERISTICS

5-1 Temperature cycling

Subject the device to a low temperature of -45℃for 30 minutes. Following by a

high temperature of +25℃ for 5 Minutes and a higher temperature of +85℃ for 30

Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the

measurement. It shall meet the

specifications in table 1.

5-2 Resistance to solder heat

Submerge the device terminals into the solder bath at 260℃ ±5℃ for 10±1

sec. Then release the device into the room conditions for 4 hours. It shall meet the

specifications in table 1.

5-3 Solderability

Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More

than 95% area of the soldering pad must be covered with new solder. It shall meet the

specifications in table 1.

5-4 Mechanical shock

Drop the device randomly onto the concrete floor from the height of 1 m 3 times.

the filter shall fulfill the specifications in table 1.

5-5 Vibration

Subject the device to the vibration for 2 hour each in x,y and z axes with the

amplitude of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in

table 1.

6. REMARK

6.1 Static voltage

Static voltage between signal load & ground may cause deterioration &destruction

of the component. Please avoid static voltage.

6.2 Ultrasonic cleaning

Ultrasonic vibration may cause deterioration & destruction of the

component.

Please avoid ultrasonic cleaning

6.3 Soldering

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