Copyright

© ANPEC Electronics Corp.

Rev. A.3 - Jun., 2009

APL5910

www.anpec.com.tw

2

Ordering and Marking Information

Symbol

Parameter

Rating

Unit

VCNTL Supply Voltage (VCNTL to GND)

-0.3 ~ 6

V

VIN Supply Voltage (VIN to GND)

-0.3 ~ 6

V

VOUT to GND Voltage

V

POK to GND Voltage

-0.3 ~ 7

EN, FB to GND Voltage

V

Power Dissipation

2.5

W

Maximum Junction Temperature

150

Storage Temperature Range

-65 ~ 150

Maximum Lead Soldering Temperature, 10 Seconds

260

Absolute Maximum Ratings

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Resistance in Free Air

(Note 1)

SOP-8P

50

θ

JC

Junction-to-Case Resistance in Free Air

(Note 2)

SOP-8P

20

Note 1:

θ

Note 2: The “Thermal-Pad Temperature” is measured on the PCB copper area connected to the thermal pad of package.

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

1

2

3

4

8

7

6

5

Measured Point

PCB Copper

APL5910

Handling Code

Temperature Range

Package Code

Package Code

KA : SOP-8P

Operating Ambient Temperature Range

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

Assembly Material

APL5910 KA :

APL5910

XXXXX

XXXXX - Date Code

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.