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| NCP693HMN33TCG |
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 ONSEMI
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4 page 
NCP693 http://onsemi.com 4 APPLICATIONS INFORMATION A typical application circuit for the NCP693 series is shown in Figure 2. Input Decoupling (C1) A 2.2 mF capacitor either ceramic or tantalum is recommended and should be connected as close as possible to the pins of NCP693 device. Higher values and lower ESR will improve the overall line transient response. Output Decoupling (C2) The minimum decoupling value is 2.2 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. If a tantalum capacitor is used, and its ESR is large, the loop oscillation may result. Because of this, select C2 carefully considering its frequency characteristics. Larger values improve noise rejection and load regulation transient response. Enable Operation The enable pin CE will turn on or off the regulator. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used then the pin should be connected to Vin. The D version devices (NCP693DMNxxTCG) have additional circuitry in order to reach the turnâoff speed faster than normal type. When the mode is into standby with CE signal, auto discharge transistor turns on. Hints Please be sure the Vin and GND lines are sufficiently wide. If their impedance is high, noise pickup or unstable operation may result. Set external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. Thermal As power across the NCP693 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the NCP693 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. Figure 2. Typical Application Circuit |
