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NB6HQ14MMNHTBG Datasheet(PDF) 3 Page - ON Semiconductor

Part # NB6HQ14MMNHTBG
Description  2.5V 5GHz / 6.5Gbps Differential Input to 1.8V / 2.5V 1:4 CML Clock / Data Fanout Buffer
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NB6HQ14MMNHTBG Datasheet(HTML) 3 Page - ON Semiconductor

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NB6HQ14M
http://onsemi.com
3
EQEN Q3
Q3 VCCO
GND Q0
Q0
VCC
Q1
Q1
Q2
Q2
IN
VT
VREFAC
IN
56
7
8
16
15
14
13
12
11
10
9
1
2
3
4
NB6HQ14M
Exposed Pad (EP)
Figure 2. QFN−16 Pinout (Top View)
Table 1. EQUALIZER ENABLE FUNCTION
EQEN
Function
0
IN / IN Inputs By−pass the Equalizer section
1
Inputs flow through the Equalizer
Table 2. PIN DESCRIPTION
Pin
Name
I/O
Description
1
IN
LVPECL, CML,
LVDS Input
Non−inverted Differential Input. Note 1.
2
VT
Internal 100 W Center−tapped Termination Pin for IN / IN
3
VREFAC
Output Voltage Reference for Capacitor−Coupled Inputs, only
4
IN
LVPECL, CML,
LVDS Input
Inverted Differential Input. Note 1.
5
EQEN
LVCMOS Input
Equalizer Enable Input; pin will default LOW when left open (has internal pull−down resistor)
6
Q3
CML Output
Inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
7
Q3
CML Output
Non−inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
8
VCCO
1.8 V or 2.5 V Positive Supply Voltage for the Qn / Qn CML Outputs
9
Q2
CML Output
Inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
10
Q2
CML Output
Non−inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
11
Q1
CML Output
Inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
12
Q1
CML Output
Non−inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
13
VCC
2.5 V Positive Supply Voltage for the core
14
Q0
CML Output
Inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
15
Q0
CML Output
Non−inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
16
GND
Negative Supply Voltage
EP
The Exposed Pad (EP) on the QFN−16 package bottom is thermally connected to the die for
improved heat transfer out of package. The exposed pad must be attached to a heat−sinking
conduit. The pad is electrically connected to the die, and must be electrically and thermally con-
nected to GND on the PC board.
1. In the differential configuration when the input termination pin (VT) is connected to a common termination voltage or left open, and if no signal
is applied on IN / IN input, then, the device will be susceptible to self−oscillation.
2. All VCC, VCCO and GND pins must be externally connected to a power supply for proper operation.


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