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ATmega165V-8MI Datasheet(PDF) 2 Page - ATMEL Corporation |
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ATmega165V-8MI Datasheet(HTML) 2 Page - ATMEL Corporation |
2 / 336 page 2 ATmega165/V 2573G–AVR–07/09 Pin Configurations Figure 1. Pinout ATmega165 Note: The large center pad underneath the QFN/MLF packages is made of metal and internally connected to GND. It should be soldered or glued to the board to ensure good mechani- cal stability. If the center pad is left unconnected, the package might loosen from the board. Disclaimer Typical values contained in this datasheet are based on simulations and characteriza- tion of other AVR microcontrollers manufactured on the same process technology. Min and Max values will be available after the device is characterized. PC0 (RXD/PCINT0) PE0 (TXD/PCINT1) PE1 DNC (XCK/AIN0/PCINT2) PE2 (AIN1/PCINT3) PE3 (USCK/SCL/PCINT4) PE4 (DI/SDA/PCINT5) PE5 (DO/PCINT6) PE6 (CLKO/PCINT7) PE7 (SS/PCINT8) PB0 (SCK/PCINT9) PB1 (MOSI/PCINT10) PB2 (MISO/PCINT11) PB3 (OC0A/PCINT12) PB4 (OC1B/PCINT14) PB6 (OC1A/PCINT13) PB5 PC1 PG0 PC2 PC3 PC4 PC5 PC6 PC7 PA7 PG2 PA6 PA5 PA4 PA3 PG1 ATmega165 INDEX CORNER 2 3 1 4 5 6 7 8 9 10 11 12 13 14 16 15 47 46 48 45 44 43 42 41 40 39 38 37 36 35 33 34 |
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