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EUP7907-28JIR1 Datasheet(PDF) 11 Page - Eutech Microelectronics Inc |
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EUP7907-28JIR1 Datasheet(HTML) 11 Page - Eutech Microelectronics Inc |
11 / 13 page EUP7907 DS7907 Ver 1.1 Oct . 2008 11 ( ) Q IN OUT OUT IN D I V I V V P × + × − = W 455 . 0 220 ) C 25 C 125 ( P ) MAX ( D = ° − ° = W 667 . 1 60 ) C 25 C 125 ( P ) MAX ( D = ° − ° = JA A ) MAX ( J ) MAX ( D ) T T ( P θ − = Application Information Resistors Select Choose R2=100k to optimize accuracy, power supply rejection, noise and power consumption. And the R1 can be chosen by: OUT 12 REF V RR ( 1) V =− (EQ. 2) where VREF is the internal reference voltage, which is 0.8V in EUP7907. External Capacitor Like other low-dropout regulator, the EUP7907 requires external capacitors for stability. It is specifically designed for low-ESR capacitors requiring minimum PCB area and smallest components. Input Capacitor A 2.2uF capacitor is required between the VIN pin and the GND pin. Place it as close as possible to the device. There are no requirements for the ESR on the input capacitor, but the tolerance and temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will be 2.2uF over the whole operating temperature range. Output Capacitor The EUP7907 is designed specifically to work with very small ceramic output capacitors. A 2.2uF to 10uF with 5mΩ to 500mΩ ESR range is suitable in the EUP7907 application circuit. The ESR of a typical 2.2uF ceramic capacitor is about 20mΩ, which easily meets the ESR requirement for stability. Capacitor Characteristics More consideration should be taken when selecting the capacitor because its capacitance can vary with temperature. The capacitor type X7R or X5R, which operates over a temperature range of -40℃ to +85℃, will only vary within ±15%. Some large value ceramic capacitors are manufactured with Z5U or T5V temperature characteristics. Their capacitance can drop by more than 50% as the temperature goes from 25℃ to 85℃. Therefore the capacitor type X7R or X5R is recommended in applications where the ambient temperature will change significantly above or below 25℃. No Load Stability The EUP7907 will remains stable and in regulation with no external load. This is special important in CMOS RAM keep-alive applications. Thermal Considerations Thermal protection limits power dissipation in EUP7907.When the operation junction temperature exceeds 170°C, the OTP circuit starts the thermal shutdown function and turns the pass element off. The pass element turn on again after the junction temperature cools by 30°C. For continuous operation, do not exceed absolute maximum operation junction temperature 125°C. The power dissipation definition in device is: (EQ.3) The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula : (EQ.4) Where TJ(MAX) is the maximum operation junction temperature 125°C, TA is the ambient temperature and the θJA is the junction to ambient thermal resistance. For recommended operating conditions specification of EUP7907, where TJ(MAX) is the maximum junction temperature of the die (125°C) and TA is the operated ambient temperature. The junction to ambient thermal resistance θJA is layout dependent. For SOT-23-5 package, the thermal resistance θJA is 220°C/W on the standard thermal test board. For TDFN-8 package, the thermal resistance θJA is 60°C/W on the standard thermal test board. The maximum power dissipation at TA = 25°C can be calculated by following formula : (EQ.5) for SOT23-5 package (EQ.6) for TDFN-8 package The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. For EUP7907 packages, the Figure 5 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed. Figure 5. Power Dissipation for EUP7907 Packages The EUP7907 is available in two standard packages: TDFN-8 and SOT23-5 packages. |
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