CPC5710N

R02

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9

4. Manufacturing Information

Note that the CPC5710N branding (package

imprinting) leaves off the last character of the part

number, the letter “N,” due to package space

limitations.

4.1 Mechanical Dimensions

4.1.1 8-Pin SOIC Package

4.1.2 Tape and Reel Specifications

8-Pin SOIC Package

Recommended PCB Land Pattern

Dimensions

mm

(inches)

1.52 / 1.73

(0.06 / 0.07)

0.53 REF

(0.021 REF)

0.10 / 0.25

(0.004 / 0.010)

4.80 / 4.98

(0.19 / 0.20)

PIN 1

0.356 / 0.457

(0.014 / 0.018)

5.80 / 6.20

(0.23 / 0.24)

3.81 / 3.99

(0.15 / 0.16)

1.27 TYP

(0.05 TYP)

0.41 / 1.27

(0.016 / 0.050)

0.19 / 0.25

(0.008 / 0.010)

1.37 / 1.58

(0.05 / 0.06)

1.27

(0.050)

5.40

(0.213)

1.55

(0.061)

0.60

(0.024)

Tape and Reel Packaging for 8-Pin SOIC Package

Top Cover

Tape

P = 8.00

± 0.10

(0.315

± 0.004)

User Direction of Feed

W = 12.00

± 0.30

(0.472

± 0.012)

B

(0.209

± 0.004)

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

A

(0.256

± 0.004)

330.2 DIA.

(13.00 DIA.)

NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2

K

(0.083

± 0.004)

Dimensions

mm

(inches)