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L9D340G64BG2 Datasheet(PDF) 1 Page - LOGIC Devices Incorporated |
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L9D340G64BG2 Datasheet(HTML) 1 Page - LOGIC Devices Incorporated |
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1 / 155 page  integrated module products LOGIC Devices Incorporated www.logicdevices.com 1 May 19, 2009 LDS-L9D340G6BG2-A 4.0 Gb, DDR3, 64 M x 64 Integrated Module (IMOD) PRELIMINARY INFORMATION L9D340G64BG2 High Performance, Integrated Memory Module Product DDR3 Integrated Module [iMOD]: • Vcc=VccQ=1.5V ± 0.075V • 1.5V center-terminated, push/pull I/O • Package: 16mm x 22mm, 13 x 21 matrix w/ 271balls • Matrix ball pitch: 1.00mm Space saving footprint Thermally enhanced, Impedance matched, integrated packaging Differential, bidirectional data strobe 8n-bit prefetch architecture 8 internal banks (per word, 4 words integrated in package) Nominal and dynamic on-die termina- tion (ODT) for data, strobe, and mask signals. CAS (READ) latency (CL): 6, 8, and 10 CAS (WRITE) latency (CWL): 6, 7 and 8 Fixed burst length (BL) of 8 and burst chop (BC) of 4 Selectable BC4 or BL8 on-the-fly (OTF) FEATURES Self/Auto Refresh modes Operating Temperature Range (Case Temp=Tc) • Industrial: -40˚C to 85˚C supporting SELF & AUTO REFRESH • Extended: -40˚C to 105˚C; manual REFRESH only • Mil-Temp: -55˚C to 125˚C; manual REFRESH only CORE clocking frequencies: • Industrial: 667MHz, 533MHz and 400MHz • Extended: 533MHz and 400MHz • Mil-Temp: 400MHz Data Transfer Rates: • Industrial: 1333, 1066 and 800 Mbps • Extended: 1066 and 800 Mbps • Mil-Temp: 800 Mbps Write leveling Multipurpose register Output Driver Calibration 40% space savings while provid- ing a surface mount friendly pitch (1.00mm) Reduced I/O routing (34%) 30% improvement in routings for your memory array Reduced trace lengths due to the highly integrated, impedance matched packaging Thermally enhanced packaging technology allow silicon integration without performance degradation due to power dissipation (heat) High TCE organic laminate inter- poser for improved glass stability over a wide operating temperature Suitability of use in High Reliability applications requiring Mil-temp, non- hermetic device operation Benefits *Note: This integrated product and/or its specifications are subject to change without notice. Latest document should be retrieved from LDI prior to your design consideration. ORDER NUMBER SPEED GRADE DEVICE GRADE PKG FOOTPRINT I/O PITCH PKG NO. 16mm x 22mm 271 DDR3-1333 DDR3-1066 DDR3-800 Industrial Extended Mil-Temp L9D340G64BG2I15 L9D340G64BG2E19 L9D340G64BG2M25 iMOD Part Information BG2 1.00mm |
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