www.clare.com

4

CPC1303

R02

MECHANICAL DIMENSIONS

RoHS

2002/95/EC

Pb

Manufacturing Information

Soldering

For proper assembly, the component must be

processed in accordance with the current revision

of IPC/JEDEC standard J-STD-020. Failure to

follow the recommended guidelines may cause

permanent damage to the device resulting in impaired

performance and/or a reduced lifetime expectancy.

Washing

Clare does not recommend ultrasonic cleaning or the

use of chlorinated solvents.

4-Pin DIP (”G” Suffix)

PC Board Pattern (Top View)

Dimensions

mm

(inches)

PIN 1

6.350 ± 0.127

(0.250 ± 0.005)

4.572 ± 0.127

(0.180 ± 0.005)

0.991

(0.039)

9º (ALL)

3.30 ± 0.050

(0.130 ± 0.002)

0.254

(0.010)

9.144 ± 0.508

(0.360 ± 0.020)

7.620 ± 0.254

(0.300 ± 0.010)

7.620 ± 0.127

(0.300 ± 0.005)

2.540 ± 0.127

(0.100 ± 0.005)

6 - 0.800 DIA.

(6 - 0.031 DIA.)

6.350 ± 0.127

(0.250 ± 0.005)

9º (ALL)

0.457 ± 0.076

(0.018 ± 0.003)

2.540 ± 0.127

(0.100 ± 0.005)

3.175

(0.125)

0.508

(0.020)

1.651

(0.065)

PIN #1

6.350 ± 0.127

(0.250 ± 0.005)

0.991

(0.039)

9.525

(0.375)

2.540 ± 0.127

(0.100 ± 0.005)

4-Pin Surface Mount (”GR” Suffix)

7.620 ± 0.254

(0.300 ± 0.010)

0.635 ± 0.254

(0.025 ± 0.010)

0.254

(0.010)

3.300 ± 0.050

(0.130 ± 0.002)

3.480 ± 0.076

(0.137 ± 0.003)

Recommended PCB Land Pattern

Dimensions

mm

(inches)

2.287

(0.09)

8.80

(0.346)

1.60

(0.063)

0.95

(0.037)

9º ± 1º

(ALL)

0.102 min / 0.254 max

(0.004 min / 0.010 max)

4.572 ± 0.127

(0.180 ± 0.005)

2.540 ± 0.127

(0.100 ± 0.005)

2.287 ± 0.127

(0.090 ± 0.005)