1

FEATURES

APPLICATIONS

DESCRIPTION/

DRC PACKAGE

(TOP VIEW)

1

10

2

9

3

8

4

7

S

D+

D–

OE

1D+

1D–

2D+

2D–

GND

5

6

RSE PACKAGE

(TOP VIEW)

1

10

2

9

3

8

4

7

S

D+

D–

OE

1D+

1D–

2D+

2D–

GND

5

6

RSE PACKAGE

(BOTTOM VIEW)

1

10

2

9

3

8

4

7

S

D+

D–

OE

1D+

1D–

2D+

2D–

GND

5

6

TS3USB221E

HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH

WITH SINGLE ENABLE AND IEC LEVEL 3 ESD PROTECTION

• V

• Switch I/Os Accept Signals Up to 5.5 V

• 1.8-V Compatible Control-Pin Inputs

• Low-Power Mode When OE Is Disabled (1 µA)

• r

• r

• C

• Low Power Consumption (30 µA Maximum)

• ESD Performance Tested Per JESD 22

–

7000-V Human-Body Model

(A114-B, Class II)

–

1000-V Charged-Device Model (C101)

• ESD Performance I/O Port to GND

–

12-kV Human Body Model (A114-B, Class II)

–

±7-kV Contact Discharge (IEC 61000-4-2)

• High Bandwidth (1 GHz Typical)

• Routes Signals for USB 1.0, 1.1, and 2.0

ORDERING INFORMATION

The

TS3USB221E

is

a

high-bandwidth

switch

specially designed for the switching of high-speed

USB

2.0

signals

in

handset

and

consumer

applications, such as cell phones, digital cameras,

and notebooks with hubs or controllers with limited

USB I/Os. The wide bandwidth (1 GHz) of this switch

allows signals to pass with minimum edge and phase

distortion. The device multiplexes differential outputs

from a USB host device to one of two corresponding

outputs. The switch is bidirectional and offers little or

no attenuation of the high-speed signals at the

outputs. It is designed for low bit-to-bit skew and high

channel-to-channel noise isolation, and is compatible

with various standards, such as high-speed USB 2.0

(480 Mbps).

The TS3USB221E integrates ESD protection cells on

all pins, is available in a SON package (3 mm ×

3 mm) as well as in a tiny

µQFN package (2 mm ×

1.5 mm) and is characterized over the free air

temperature range from –40°C to 85°C.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

UNLESS

OTHERWISE

NOTED

this

document

contains

Copyright © 2009, Texas Instruments Incorporated

PRODUCTION DATA information current as of publication date.

Products conform to specifications per the terms of Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.