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MBD110DWT1 Datasheet(PDF) 1 Page - Motorola, Inc |
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MBD110DWT1 Datasheet(HTML) 1 Page - Motorola, Inc |
1 / 8 page 1 Motorola Small–Signal Transistors, FETs and Diodes Device Data Dual Schottky Barrier Diodes Application circuit designs are moving toward the consolidation of device count and into smaller packages. The new SOT–363 package is a solution which simplifies circuit design, reduces device count, and reduces board space by putting two discrete devices in one small six–leaded package. The SOT–363 is ideal for low–power surface mount applications where board space is at a premium, such as portable products. Surface Mount Comparisons: SOT–363 SOT–23 Area (mm2) 4.6 7.6 Max Package PD (mW) 120 225 Device Count 2 1 Space Savings: Package 1 SOT–23 2 SOT–23 SOT–363 40% 70% The MBD110DW, MBD330DW, and MBD770DW devices are spin–offs of our popular MMBD101LT1, MMBD301LT1, and MMBD701LT1 SOT–23 devices. They are designed for high–efficiency UHF and VHF detector applications. Readily available to many other fast switching RF and digital applications. • Extremely Low Minority Carrier Lifetime • Very Low Capacitance • Low Reverse Leakage MAXIMUM RATINGS Rating Symbol Value Unit Reverse Voltage MBD110DWT1 MBD330DWT1 MBD770DWT1 VR 7.0 30 70 Vdc Forward Power Dissipation TA = 25°C PF 120 mW Junction Temperature TJ – 55 to +125 °C Storage Temperature Range Tstg – 55 to +150 °C DEVICE MARKING MBD110DWT1 = M4 MBD330DWT1 = T4 MBD770DWT1 = H5 Thermal Clad is a trademark of the Bergquist Company. Preferred devices are Motorola recommended choices for future use and best overall value. Order this document by MBD110DWT1/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA MBD110DWT1 MBD330DWT1 MBD770DWT1 CASE 419B–01, STYLE 6 SOT–363 1 2 3 6 5 4 Motorola Preferred Devices © Motorola, Inc. 1996 |
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