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MIC2164-3YMM Datasheet(PDF) 2 Page - Micrel Semiconductor |
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MIC2164-3YMM Datasheet(HTML) 2 Page - Micrel Semiconductor |
2 / 36 page Micrel, Inc. MIC2164/-2/-3 September 2009 2 M9999-090409-B Ordering Information Part Number Voltage Switching Frequency Junction Temp. Range Package Lead Finish MIC2164YMM Adj. 300kHz –40° to +125°C 10-pin MSOP Pb-Free MIC2164-2YMM Adj. 600kHz –40° to +125°C 10-pin MSOP Pb-Free MIC2164-3YMM Adj. 1MHz –40° to +125°C 10-pin MSOP Pb-Free Pin Configuration 10-Pin MSOP (MM) Pin Description Pin Number Pin Name Pin Function 1 HSD High-Side N-MOSFET Drain Connection (input): Power to the drain of the external high-side N-channel MOSFET. The HSD operating voltage range is from 3V to 28V. Input capacitors between HSD and the power ground (PGND) are required. 2 EN Enable (input): A logic level control of the output. The EN pin is CMOS-compatible. Logic high or floating = enable, logic low = shutdown. In the off state, supply current of the device is greatly reduced (typically 0.8mA). 3 FB Feedback (input): Input to the transconductance amplifier of the control loop. The FB pin is regulated to 0.8V. A resistor divider connecting the feedback to the output is used to adjust the desired output voltage. 4 GND Signal ground. GND is the ground path for the device input voltage VIN and the control circuitry. The loop for the signal ground should be separate from the power ground (PGND) loop. 5 IN Input Voltage (input): Power to the internal reference and control sections of the MIC2164/-2/-3. The IN operating voltage range is from 3V to 5.5V. A 1µF and 0.1µF ceramic capacitors from IN to GND are recommended for clean operation. 6 DL Low-Side Drive (output): High-current driver output for external low-side MOSFET. The DL driving voltage swings from ground-to-IN. 7 PGND Power Ground. PGND is the ground path for the MIC2164/-2/-3 buck converter power stage. The PGND pin connects to the sources of low-side N-Channel MOSFETs, the negative terminals of input capacitors, and the negative terminals of output capacitors. The loop for the power ground should be as small as possible and separate from the Signal ground (GND) loop. 8 DH High-Side Drive (output): High-current driver output for external high-side MOSFET. The DH driving voltage is floating on the switch node voltage (LX). It swings from ground to VIN minus the diode drop. Adding a small resistor between DH pin and the gate of the high-side N-channel MOSFETs can slow down the turn-on and turn-off time of the MOSFETs. 9 LX Switch Node and Current Sense input: High current output driver return. The LX pin connects directly to the switch node. Due to the high speed switching on this pin, the LX pin should be routed away from sensitive nodes. LX pin also senses the current by monitoring the voltage across the low-side MOSFET during OFF time. In order to sense the current accurately, connect the low-side MOSFET drain to LX using a Kelvin connection. 10 BST Boost (output): Bootstrapped voltage to the high-side N-channel MOSFET driver. A Schottky diode is connected between the IN pin and the BST pin. A boost capacitor of 0.1μF is connected between the BST pin and the LX pin. Adding a small resistor in series with the boost capacitor can slow down the turn-on time of high-side N-Channel MOSFETs. |
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