MPXH6250A

Sensors

Freescale Semiconductor

5

Pressure

SURFACE MOUNTING INFORMATION

Minimum Recommended Footprint for Super Small Outline Packages

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor package must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct pad

geometry, the packages will self-align when subjected to a

solder reflow process. It is always recommended to fabricate

boards with a solder mask layer to avoid bridging and/or

shorting between solder pads, especially on tight tolerances

and/or tight layouts.

Figure 5. SSOP Footprint (Case 1317 and 1317A)

Transfer Function

Temp

Multiplier

-40

3

0 to 85

1

125

1.75

Temperature in °C

4.0

3.0

2.0

0.0

1.0

-40

-20

0

20

40

60

140

120

100

80

Temperature

Error

Factor

NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C.

Temperature Error Band

Pressure

Error (Max)

Pressure Error Band

20 to 250 (kPa)

±3.45 (kPa)

Pressure (in kPa)

Error Limits for Pressure

Break Points

3.0

2.0

1.0

-1.0

-2.0

-4.0

0.0

4.0

-3.0

20

60

100

140

180

220

260

300

0.027 TYP 8X

0.69

0.053 TYP 8X

1.35

inch

mm

0.387

9.83

0.150

3.81

0.050

1.27

TYP