Part Name
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EBE11ED8AGWA-5C-E

 1GB Unbuffered DDR2 SDRAM DIMM ( 25 Page)


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EBE11ED8AGWA
Preliminary Data Sheet E0920E10 (Ver. 1.0)
12
Parameter
Symbol
Grade
max.
Unit
Test condition
Self-refresh current
IDD6
108
mA
Self Refresh Mode;
CK and /CK at 0V;
CKE
≤ 0.2V;
Other control and address bus inputs are FLOATING;
Data bus inputs are FLOATING
Operating current
(Bank interleaving)
(Another rank is in IDD2P)
IDD7
-6E
-5C
2970
2970
mA
Operating current
(Bank interleaving)
(Another rank is in IDD3N)
IDD7
-6E
-5C
3510
3465
mA
all bank interleaving reads, IOUT = 0mA;
BL = 4, CL = CL(IDD), AL = tRCD (IDD)
−1
× tCK (IDD);
tCK = tCK (IDD), tRC = tRC (IDD), tRRD = tRRD(IDD),
tRCD = 1
× tCK (IDD);
CKE is H, CS is H between valid commands;
Address bus inputs are STABLE during DESELECTs;
Data pattern is same as IDD4W;
Notes: 1. IDD specifications are tested after the device is properly initialized.
2. Input slew rate is specified by AC Input Test Condition.
3. IDD parameters are specified with ODT disabled.
4. Data bus consists of DQ, DM, DQS, /DQS, RDQS, /RDQS, LDQS, /LDQS, UDQS, and /UDQS. IDD
values must be met with all combinations of EMRS bits 10 and 11.
5. Definitions for IDD
L is defined as VIN
≤ VIL (AC) (max.)
H is defined as VIN
≥ VIH (AC) (min.)
STABLE is defined as inputs stable at an H or L level
FLOATING is defined as inputs at VREF = VDDQ/2
SWITCHING is defined as:
inputs changing between H and L every other clock cycle (once per two clocks) for address and control
signals, and inputs changing between H and L every other data transfer (once per clock) for DQ signals
not including masks or strobes.
6. Refer to AC Timing for IDD Test Conditions.
AC Timing for IDD Test Conditions
For purposes of IDD testing, the following parameters are to be utilized.
DDR2-667
DDR2-533
Parameter
5-5-5
4-4-4
Unit
CL(IDD)
5
4
tCK
tRCD(IDD)
15
15
ns
tRC(IDD)
60
60
ns
tRRD(IDD)
7.5
7.5
ns
tCK(IDD)
3
3.75
ns
tRAS(min.)(IDD)
45
45
ns
tRAS(max.)(IDD)
70000
70000
ns
tRP(IDD)
15
15
ns
tRFC(IDD)
105
105
ns



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