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TB7102AF Datasheet(PDF) 9 Page - Toshiba Semiconductor

Part # TB7102AF
Description  Buck DC-DC Converter IC
Download  17 Pages
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TB7102AF Datasheet(HTML) 9 Page - Toshiba Semiconductor

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TB7102AF
2008-05-22
9
Usage Precautions
• The input voltage, output voltage, output current and temperature conditions should be considered when
selecting capacitors, inductors and resistors. These components should be evaluated on an actual system
prototype for best selection.
• External components such as capacitors, inductor and resistors should be placed as close to the TB7102AF as
possible.
• The TB7102AF has an ESD diode between the EN and VIN pins. The voltage between these pins should satisfy
VEN − VIN < 0.3 V.
• Operation might become unstable due to board layout. In that case, add a decoupling capacitor (CC) of 0.1 μF to
1
μF between the SGND and VIN pins.
• The overcurrent protection circuits in the Product are designed to temporarily protect Product from minor
overcurrent of brief duration. When the overcurrent protective function in the Product activates, immediately
cease application of overcurrent to Product. Improper usage of Product, such as application of current to Product
exceeding the absolute maximum ratings, could cause the overcurrent protection circuit not to operate properly
and/or damage Product permanently even before the protection circuit starts to operate.
• The thermal shutdown circuits in the Product are designed to temporarily protect Product from minor
overheating of brief duration. When the overheating protective function in the Product activates, immediately
correct the overheating situation. Improper usage of Product, such as the application of heat to Product
exceeding the absolute maximum ratings, could cause the overheating protection circuit not to operate properly
and/or damage Product permanently even before the protection circuit starts to operate.


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