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RA01L8693MA Datasheet(PDF) 10 Page - Mitsubishi Electric Semiconductor |
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RA01L8693MA Datasheet(HTML) 10 Page - Mitsubishi Electric Semiconductor |
10 / 13 page MITSUBISHI RF POWER MODULE RoHS COMPLIANT RA01L8693MA RA01L8693MA MITSUBISHI ELECTRIC 21 th Nov. 2008 10/13 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS P.C.B Land Pattern Recommendation Mounting method Mitsubishi recommends device mounting like Fig.1. In order to heat radiation, we recommend to fix the PCB and heat sink by screw. This PCB has through holes that filled up with resin to restrain the solder flow under the RF Ground. The interval of through holes is 0.4mm and these holes are arranged in the shape of equilateral triangles. # Note: Mitsubishi Heat Sink size=30 * 60 * 10 Unit: mm 0.5 2.55 4.60 8.00 8.60 EQUILATERAL TRIANGLE ARRANGEMENT THROUGH HOLE ① ② ③ ④ Reflow soldering heat sink Fig.1 RF Ground Drain RF Output Printed Circuit board Fix with screws. RF Input Gate |
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