MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>

PS21965-T/-AT/-CT/-TW

TRANSFER-MOLD TYPE

INSULATED TYPE

Mar. 2009

9

MCU

10k

Ω

Fo

DIPIPM

5V line

3.3k

Ω (min)

Error output Fo

Output current Ic

Protection circuit state

Control input

c6

c1

c2

c4

c5

c3

RESET

SET

RESET

High-level (no fault output)

N

DIPIPM

Wiring inductance should be less than 10nH.

Shunt resistor

Equivalent to the inductance of a copper

pattern in dimension of width=3mm,

thickness=100

µm, length=17mm

Please make the GND wiring connection

as close as possible.

c2. Normal operation : IGBT ON and carrying current.

c6. Normal operation : IGBT ON and carrying current.

Fig. 9 RECOMMENDED MCU I/O INTERFACE CIRCUIT

Note : The setting of RC coupling at each input (parts shown dotted) depends on the PWM control scheme and the

wiring impedance of the printed circuit board.

The DIPIPM input section integrates a 3.3k

Ω (min) pull-down resistor. Therefore, when using an external fil-

tering resistor, pay attention to the turn-on threshold voltage.

Fig. 10 WIRING CONNECTION OF SHUNT RESISTOR

Fault output Fo

Output current Ic

LVIC temperature

Protection circuit state

Control input

d1

d3

d4

d6

d5

d2

RESET

SET

[D] Over Temperature Protection (Lower-side, OT)

d1. Normal operation : IGBT ON and carrying current.

d3. IGBT OFF in spite of control input condition.

µs.

d5. LVIC temperature becomes under over temperature reset level.

d6. Circuits start to operate normally when next input is applied.