ESMT

M24L28256DA

Elite Semiconductor Memory Technology Inc.

Publication Date : Jul. 2007

Revision : 1.0

3/10

Maximum Ratings

(Above which the useful life may be impaired. For user

guide-lines, not tested.)

Storage Temperature ...................................–65°C to +150°C

Ambient Temperature with

Power Applied ..............................................–40°C to +85°C

Supply Voltage to

Ground Potential . ............... ............ ...........−0.4V to 4.6V

DC Voltage Applied to Outputs

in High-Z State[3, 4, 5] .................................−0.4V to 3.7V

DC Input Voltage[3, 4, 5].................... .........−0.4V to 3.7V

Output Current into Outputs (LOW) ...............................20 mA

Static Discharge Voltage ........................................ >2001V

(per MIL-STD-883, Method 3015)

Latch-up Current ....................................................> 200 mA

Operating Range

Range

Ambient

Extended

−25°C to +85°C

2.7V to 3.3V

Electrical Characteristics

(Over the Operating Range)

-55

-70

Parameter

Description

Test Conditions

Min.

Typ.

[2]

Max.

Min.

Typ.

[2]

Max.

Unit

Supply Voltage

2.7

3.0

3.3

2.7

3.3

V

Output HIGH

Voltage

0.4

0.4

V

Output LOW

Voltage

0.4

0.4

V

Input HIGH

Voltage

0.8*

0.4

0.8*

+0.4

V

Input LOW

Voltage

-0.4

0.4

-0.4

0.4

V

Input Leakage

Current

-1

+1

-1

+1

µA

Output Leakage

Current

Disable

-1

+1

-1

+1

µA

14

22

8

15

Supply Current

f = 1 MHz

CMOS levels

1

5

1

5

mA

Power-Down

Current

—CMOS Inputs

f = 0

40

250

40

250

µA

Power-Down

Current

—CMOS Inputs

9

40

9

40

µA

Capacitance

[6]

Parameter

Description

Test Conditions

Max.

Unit

Input Capacitance

8

pF

Output Capacitance

TA = 25°C, f = 1 MHz

8

pF

Thermal Resistance

[6]

Parameter

Description

Test Conditions

BGA

Unit

Thermal Resistance(Junction to Ambient)

55

°C/W

Thermal Resistance (Junction to Case)

Test conditions follow standard test

methods and procedures for measuring

thermal impedance, per EIA/ JESD51.

17

°C/W

Notes:

5.Overshoot and undershoot specifications are characterized and are not 100% tested.

6.Tested initially and after design or process changes that may affect these parameters.