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MS79005-A_0.5 Datasheet(PDF) 2 Page - Intersema Sensoric SA |
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MS79005-A_0.5 Datasheet(HTML) 2 Page - Intersema Sensoric SA |
2 / 5 page DA79005_000.doc May 07, 2009 2/5 000790051447 ECN 1186 BOND PAD CONFIGUTRATION Vs+/Epi Out- Out+ GND1 GND2 MS7901 R5+ R5- R6+ R6- Important remarks: As the sensing elements are diffused resistances, the voltage applied on the ground pads (GND1 and GND2) has to be lower than the voltage applied on supply voltage pad (Vs+). The epitaxial layer is connected to the Vs+ pin under the pad. Gold ball bonding or aluminium wedge bonding can be used to wire-bond the sensor. The quality of the wire-bonding is equipment and process dependant. For this reason, it is strongly recommended that a thorough wire-bonding qualification is made by the end user if the sensor is going to be operated over an extended temperature range. LAYOUT (Absolute sensors) MS79005-A_0.2 MS79005-A_0.2 Pad opening in passivation is 100 µ µ µ µm |
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