DA54xx_014

June 15th, 2009

6

000054xx280 ECN 1243

LIGHT SENSITIVITY

The MS54xx is sensitive to sunlight (visible and near-infrared spectrum). This is due to the strong photo effect of

silicon. As the effect is reversible there will be no damage, but the user has to take care that in the final product

the sensor cannot be exposed to direct light during operation as it effects the measurement. This can be

achieved for instance by placing mechanical parts with holes in such that light cannot pass.

CONNECTION TO PCB

The package outline of the module enables the use of a flexible PCB to connect it. This can be important for

applications in watches and other special devices, and will also reduce mechanical stress on the device.

For applications subjected to mechanical shock, it is recommended to enhance the mechanical reliability of the

solder junctions by covering the rim or the corners of MS54xx ceramic substrate with glue or globtop-like

material.

SOLDERING

Please refer to the application note AN808 for all soldering issues.

CLEANING

The MS54xx has been manufactured under clean-room conditions. Each device is inspected for homogeneity

and cleanness of the silicone gel. It is therefore recommended to assemble the sensor under class 10 000 or

better conditions. Should this not be possible, it is recommended to protect the sensor opening during assembly

from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “no-clean” must be used.

Cleaning might damage the sensor.

RECOMMENDED PAD LAYOUT

Recommended pad layout for soldering of the MS54xx on a printed circuit board