2

0201 Footprint Silicon Schottky Diodes

Rev. V1

MA4E2501-1290 Series

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology

Solutions is considering for development. Performance is based on target specifications,

simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications

are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be

available. Commitment to produce in volume is not guaranteed.

Elecrtrical Specifications @ 25

°C

Model

Number

Type

Recommended

Frequency

Range

Vf @ 1 mA

( mV )

Vb @ 10 uA

( V )

Ct @ 0V

( pF )

Rt Slope Resistance

( Vf1–Vf2 )/(10.5mA – 9.5mA )

(

Ω )

MA4E2501L-

1290

Low

Barrier

DC – 18 GHz

330 Max

300 Typ

3 Min

5 Typ

0.12 Max

0.10 Typ

10 Typical

14 Max

Rt is the dynamic slope resistance where Rt = Rs + Rj ,

where Rj =26 / Idc ( Idc is in mA) and Rs is the Ohmic

Resistance.

Applications

The MA4E2501L-1290 SurMount Low Barrier Schottky

diodes are recommended for use in microwave circuits

through Ku band frequencies for lower power applications

such as mixers, sub-harmonic mixers, detectors and limiters.

The HMIC construction facilitates the direct replacement of

more fragile beam lead diodes with the corresponding

Surmount diode, which can be connected to a hard or soft

Handling

All semiconductor chips should be handled with care to

avoid damage or contamination from perspiration and skin

oils. The use of plastic tipped tweezers or vacuum pickups

is strongly recommended for individual components. The

top surface of the die has a protective polyimide coating to

minimize damage.

The rugged construction of these SurMount devices allows

the use of standard handling and die attach techniques. It is

important to note that industry standard electrostatic

discharge (ESD) control is required at all times, due to the

sensitive nature of Schottky junctions.

Bulk handling should insure that abrasion and mechanical

shock are minimized.

Die Bonding

Die attach for these devices is made simple through the use

of surface mount die attach technology. Mounting pads are

conveniently located on the bottom surface of these devices,

and are opposite the active junction. The devices are well

suited for high temperature solder attachment onto hard

substrates. 80Au/20Sn and Sn63/Pb37 solders are acceptable

for usage. Die attach with Electrically Conductive Silver

Epoxy is Not Recommended.

Absolute Maximum

Parameter

Value

Operating Temperature

-40

° C to + 150° C

Storage Temperature

-40

° C to + 150° C

Forward Current

20 mA

Reverse Voltage

5V

RF C.W. Incident Power

+ 20 dBm

RF & DC Dissipated Power

50 mW

Exceeding any of these values may result in permanent damage

Die Bonding

For Hard substrates, we recommend utilizing a vacuum tip

and force of 60 to 100 grams applied uniformly to the top

surface of the device, using a hot gas bonder with equal heat

applied across the bottom mounting pads of the device.

When soldering to soft substrates, it is recommended to use a

lead-tin interface at the circuit board mounting pads. Position

the die so that its mounting pads are aligned with the circuit

board mounting pads. Reflow the solder paste by applying

Equal heat to the circuit at both die-mounting pads. The

solder joint must Not be made one at a time, creating un-

equal heat flow and thermal stress. Solder reflow should Not

be performed by causing heat to flow through the top surface

of the die. Since the HMIC glass is transparent, the edges of

the mounting pads can be visually inspected through the die

after die attach is completed.