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MASW-004103-13650P Datasheet(PDF) 6 Page - M/A-COM Technology Solutions, Inc.

Part # MASW-004103-13650P
Description  HMICTM Silicon PIN Diode SP4T Switch
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Manufacturer  MA-COM [M/A-COM Technology Solutions, Inc.]
Direct Link  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

MASW-004103-13650P Datasheet(HTML) 6 Page - M/A-COM Technology Solutions, Inc.

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6
Silicon SP4T Surface Mount HMIC PIN Diode Switch
RoHS Compliant
Rev. V5
MASW-004103-1365
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Sample Board
Samples test boards are available upon request
Handling Procedures
Attachment to a circuit board is made simple through the use of standard surface mount technology. Mounting
pads are conveniently located on the bottom of the chip and are removed from the active junction locations
making it well suited for solder attachment. Connections may be made onto hard or soft substrates via the use of
80Au/20Sn, or RoHS compliant solders. Typical re-flow profiles for provided in Application Note M538 , “Surface
Mounting Instructions“ and can viewed in the Customer Support, Technical Resources section of the MA-COM
Technology Solutions website at www.macomtech.com.
For applications where the average power is ≤ 1W, a thermally conductive silver epoxy may also be used. Cure
per manufacturers recommended time and temperature. Typically 1 hour at 150°C.
When soldering these devices to a hard substrate, a solder re-flow method is preferred. A vacuum pick up tool
with a soft tip is recommended while placing the chip . When soldering to soft substrates, such as Duroid, a soft
solder is recommended at the circuit board to chip mounting pad interface to minimize stress due to any TCE mis-
matches that may exist. Position the die so that its mounting pads are aligned with the circuit board land pads.
Solder reflow should not be performed by causing heat to flow through the top surface of the die to the back.
Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die
after attachment is completed.
PCB Land Pattern (All dims. in µm)
DC & RF GND


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