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Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

1

Digital Attenuator

30.0 dB, 4-Bit, TTL Driver, DC-2.5 GHz

Rev. V5

AT90-0233

ADVANCED:

Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY:

Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Features

• Attenuation: 2 dB Steps to 30 dB

• Low DC Power Consumption

• Small Footprint, JEDEC Package

• Integral TTL Driver

• 50 Ohm Impedance

• Test Boards Available

• Tape and Reel Packaging Available

• CSP-1 Package

Description

M/A-COM’s AT90-0233 is a GaAs FET 4-Bit digital

attenuator with integral driver. Step size is 2 dB pro-

viding a 30 dB attenuation range. This device is in

an PQFN plastic surface mount package.

The

AT90-0233 is suited for use where accuracy, fast

speed, very low power consumption and low costs

are required.

.

Ordering Information

Part Number

Package

AT90-0233

Bulk Packaging

AT90-0233TR

1000 piece reel

AT90-0233-TB

Sample Test Board

Note: Reference Application Note M513 for reel size

information.

Schematic with Off-Chip Components

Pin Configuration

Pin No.

Function

Pin No.

Function

1

GND

17

N/C

2

C16

18

N/C

3

C8

19

N/C

4

C4

20

N/C

5

C2

21

N/C

6

GND

22

N/C

7

GND

23

N/C

8

N/C

24

N/C

9

N/C

25

N/C

10

26

GND

11

GND

27

RF2

12

RF1

28

GND

13

GND

29

14

N/C

30

15

N/C

31

N/C

16

N/C

32

1. Pins 10 and 29 must be isolated.

2. The exposed pad centered on the package bottom must be

connected to RF and DC ground. (For PQFN Packages)