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MAX15046 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX15046 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 23 page 40V, High-Performance, Synchronous Buck Controller 2 ______________________________________________________________________________________ Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. IN to GND..............................................................-0.3V to +45V VCC to GND..................... -0.3V to lower of (VIN + 0.6V) and 6V EN, DRV to GND .....................................................-0.3V to +6V PGOOD to GND ....................................................-0.3V to +45V PGND to GND ......................................................-0.3V to +0.3V DL to PGND.............................................-0.3V to (VDRV + 0.3V) BST to PGND .......................................................-0.3V to +50V LX and CSP to PGND...............................................-1V to +45V LX and CSP to PGND............................-2V (50ns max) to +45V BST to LX.................................................................-0.3V to +6V CSP to LX .............................................................-0.3V to +0.3V DH to LX.................................................. -0.3V to (VBST + 0.3V) All Other Pins to GND .............................. -0.3V to (VCC + 0.3V) VCC Short Circuit to GND..........................................Continuous PGOOD Maximum Sink Current.........................................20mA Continuous Power Dissipation (TA = +70NC): 16-Pin QSOP (derate 9.6mW/NC above +70NC) .......771.5mW 16-Pin QSOP-EP (derate 22.7mW/NC above +70NC) 1818.2mW Junction-to-Case Thermal Resistance (θJC) (Note 1) 16-Pin QSOP................................................................37NC/W 16-Pin QSOP-EP ............................................................6NC/W Junction-to-Ambient Thermal Resistance (θJA) (Note 1) 16-Pin QSOP...........................................................103.7NC/W 16-Pin QSOP-EP ..........................................................44NC/W Operating Temperature Range........................ -40NC to +125NC Junction Temperature .....................................................+150NC Storage Temperature Range............................ -65NC to +150NC Lead Temperature (soldering, 10s) ................................+300NC ELECTRICAL CHARACTERISTICS (VIN = 24V, VEN = 5V, VGND = VPGND = 0V, CIN = 1FF, CVCC = 4.7FF, RRT = 49.9kI, TA = TJ = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2) ABSOLUTE MAXIMUM RATINGS Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-lay- er board. For detailed information on package thermal considerations, refer to http://www.maxim-ic.com/thermal-tutorial. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS SYSTEM SPECIFICATIONS Input-Voltage Range VIN 4.5 40 V VIN = VCC = VDRV 4.5 5.5 Quiescent Supply Current IIN_Q VIN = 24V, VFB = 0.9V, no switching 2 3 mA Shutdown Supply Current IIN_SBY VIN = 24V, VEN = 0V, IVCC = 0, PGOOD = unconnected 0.35 0.55 mA VCC REGULATOR Output Voltage VVCC 6V ≤ VIN ≤ 40V, ILOAD = 6mA 5 5.25 5.5 V VCC Regulator Dropout VIN = 4.5V, ILOAD = 25mA 0.18 0.45 V VCC Short-Circuit Output Current VIN = 5V 30 55 90 mA VCC Undervoltage Lockout VCCUVLO VVCC rising 3.8 4 4.2 V VCC Undervoltage Lockout Hysteresis 400 mV ERROR AMPLIFIER (FB, COMP) FB Input-Voltage Set Point VFB 584 590 596 mV FB Input Bias Current IFB VFB = 0.6V -250 +250 nA FB to COMP Transconductance gM ICOMP = Q20FA 600 1200 1800 F S Open-Loop Gain 80 dB Unity-Gain Bandwidth Capacitor from COMP to GND = 47pF 5 MHz |
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